2 layers keypad board
Gold finger board
Ceramic wafer high frequency board
10 Layers communication board
PTFE high frequency board
4 layers Golden board
3OZ 4 layers board
Double-sided LCD board
Aluminum board
2OZ 8 layers board
8 layers impedance board
Double-sided LED board
| No | Item(Description) | Manufacturing Capability(Specification) |
| 1 |  Layers |
2-30 |
| 2 | Board type |
FR-4, Metal base plate, High frequency materials |
| 3 | Max. PCB board dimension |
500mm X 600mm |
| 4 | PCB dimension tolerance |
±0.1mm |
| 5 | Finish thickness |
0.20mm- 3.00mm |
| 6 | Finish thickness tolerance |
±10% |
| 7 | Medium thickness |
0.075mm - 5.00mm |
| 8 | Min. conductor width |
0.1mm |
| 9 | Min. conductor spacing |
0.1mm |
| 10 | Outer copper thickness |
35um - 175um |
| 11 | Inner copper thickness |
17um - 175um |
| 12 | Drilling aperture (Mechanical drill) |
0.20mm- 6.35mm |
| 13 | Hole position tolerance (Mechanical drill) |
0.076mm |
| 14 | Into holes (Mechanical drill) |
0.15mm- 6.30mm |
| 15 | Aperture tolerance (Mechanical drill) |
0.076mm |
| 16 | Thickness aperture |
10:1 |
| 17 | S/M Type |
Photosensitive ink ,Curing ink , Inferior smooth printing ink |
| 18 | Min. Solder Mask bridge |
0.1mm |
| 19 | Min. S/M spacer ring |
0.1mm |
| 20 | Impedance tolerance |
±10% |
| 21 | Surface treatment |
HAL, ENIG,Immersion Silver/TIN,OSP etc. |
| 22 | Countersink hole |
Min.depth(D)6mil;The Depth of tolerance ±6mil |
|
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Drilling
Plating line
Flying probe
Microtome
Oven
Scrubbing machine
Scrubbing machine
Etching machine
Silk-screen exposure
Developer
Exclusive testing
Drilling